T4 Solder Paste Sn42Bi57.6Ag0.4Description This lead free, RoHS compliant T4 tin bismuth solder paste is composed of 42% Tin, 57% Bismuth, and 0. 4% Silver. The addition of bismuth lowers the reflow temperature compared to other alloys, making it ideal for use with silver traces printed using the V One PCB printer. This solder paste is compatible with both V One printed boards and pre fabricated circuit boards. Specifications Particle size: T4 Alloy composition: Sn42Bi57. 6Ag0. 4
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